Inspecting BGA, CSP, Flip Chip, and Other Hidden Solder Connections

In this article we will investigate an Improved Imaging System as a cost-effective alternative for, or supplement to current X-ray technology for inspecting hidden soldered connections. In addition to the high-powered optical solution which portrays the critical innovation, a linked measurement and control software will be discussed which represents a completely new standard for failure recognition and total quality assurance management.