In this white paper package design, reflow profiles, and solder paste chemistry are discussed in the form of application studies.
Optimizing Stencil Design for Lead-Free SMT Processing
In addition to aperture design guidelines, methods of optimizing the overall stencil design will be reviewed.
Vapor Phase Reflow Soldering Helps Eliminate Manufacturability Challenges
Smaller products translate to denser printed circuit board (PCB) layouts, smaller, more complex components and inaccessible
interconnections.
Vapor phase soldering can improve solder paste wetting and SIR results.
Vapor phase reflow is a mature process that solves the issue of preserving small discrete components on large thermal mass assemblies. It has shown in this testing, and previously reported work to afford superior wetting to convection oven reflow.
Evaluation of Under Stencil Cleaning Paper
All under stencil cleaning paper is not manufactured the same way nor clean solder paste from the stencil with equal effectiveness…
Use Of 3 Thermocouples To Verify A Printed Circuit Board Profile During The Reflow Operation
This paper presents the results of an initial study to determine if the use of only 3 thermocouples can be utilized to verify a PCB’s profile during the reflow operation…
Placement equipment: Where Productivity Meets Profitability
Placement equipment: Where Productivity Meets Profitability Buyers’ and sellers’ insights…
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3D Solder Paste Inspection, a Yield Improvement Strategy that Works
Learn to understand what your yields are, how they are affected by the printing process, how to measure them…
The Basics of Reflow Soldering
The basics of reflow soldering, a thermal process designed to melt solder paste which has been placed on the…
Print and Profile Fine Feature Parts
This article will discuss the several aspects of printing fine featured surface mount devices including stencils, solder paste…