Combating Oxidation and Inter-metallics in Moisture Sensitive Components

To combat Oxidation and Inter-metallics to avoid the damage of micro cracks and delamination during the processing of electronic components, it is essential to provide appropriate environmental storage. The introduction of lead-free soldering and the higher processing temperatures involved increases the consequent saturated vapor pressure within components considerably (up to 30 bars). The same component that could safely be processed before lead free becomes a moisture sensitive device with limited floor life. The difference is often 2 sensitivity levels higher classification (MSL) and shorter allowable exposure time (“floor life”).