Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production

Due to the ongoing trend towards miniaturization of power components, the lossless thermal conductivity of solder joints in SMT-processes gains more and more importance. Therefore, the role of voidfree solder joints in power electronics becomes more central. Voids developing during soldering reduce the actual thermal transfer and can cause thermal damage of the power components up to their failure. For this reason, Ersa GmbH has developed a new technique to minimize the formation of those voids during the soldering process and has tested its practicability in industrial soldering processes as well as its influence on process time.