Alpha OM-358 Solder Paste
ALPHA® OM-358 is a lead-free, zero-halogen, no-clean solder paste designed to provide ultra-low voiding performance on all component types including bottom termination components. ALPHA® OM-358 achieves IPC Class III voiding on BGA components and less than 10% voiding on bottom termination components. This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
Alpha OM-353 Solder Paste
ALPHA OM-353 is a Type 5 capable, lead-free, no-clean solder paste engineered to give excellent ultra-fine feature printing performance, provide high print volume repeatability, and reflow effectively in an air environment. A single solder paste to meet a variety of assembly conditions.
CVP-520 Solder Paste
Introducing ALPHA® CVP-520, a low melting point, lead-free no clean solder paste from Cookson Electronics.
OM-338 Solder Paste
Alpha OM-338 solder paste is a superior lead-freesolder paste that simplifies the transition to lead-free soldering.
OM-325 Solder Paste
Alpha OM-325 solder paste is a superior lead-freesolder paste that simplifies the transition to µ-fine featured printing.